Aerospace Performance Parts is pleased to offer immediate purchasing options for Hittite Microwave Corporation part number HMC284MS8G, which you have taken interest in. This Microcircuit Linear item is listed alongside the NSN 5962-01-576-4945 for ease of identification, with various additional information provided on this page for your reference. Should you wish to obtain solutions on this particular listing, we invite you to complete the Request for Quote (RFQ) form on this page at your earliest convenience. Responses are always offered shortly after we receive and review each request, with solutions we give being fully based on the details we are provided.
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If you happen to require expedited shipping for part number HMC284MS8G or any other FSC 5962 Microcircuits Electronic components we carry from Hittite Microwave Corporation under CAGE Code 1CN88, be sure to let us know as soon as possible. We would be happy to discuss the options that we can potentially provide, our track record of on-time delivery being a testament to our dedication to customer satisfaction. You can either include such details within your request, or get in touch with staff directly. Otherwise, request a quote on NSN 5962-01-576-4945 part number HMC284MS8G today, knowing we will support all your operational needs with care.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-576-4945 Item PartTypeName: MICROCIRCUIT,LINEAR | 5962 | 015764945 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 91793094 | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CXCY | Part Name Assigned By Controlling Agency | LOW STRESS INJECTION MOLDED PLASTIC |
| MRC | Decoded Requirement | Clear Text Reply |
| FEAT | Special Features | LEADFRAME MATERIAL, COPPER ALLOY; DIMENSIONS ARE IN INCHES (MILLIMETERS); DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15MM PER SIDE; DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25MM PER SIDE; ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND; THIS ITEM IS A LOW-COST SPDT SWITCH IN 8-LEAD GROUNDED BASE MSOP PACKAGES; THE DESIGM HAS BEEN OPTIMIZED TO PROVIDE HIGH ISOLATION WITH MINIMAL INSERTION LOSS FOR MEDIUM AND LOW POWER APPLICATIONS; ON-CHIP CIRCUITRY ALLOWS POSITIVE VOLTAGE CONTROL OPERATION AT VERY LOW DC CURRENTS WITH CONTROL INPUTS COMPATIBLE WITH CMOS AND MOST TTL LOGIC FAMILIES |
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